Na Lako Nana Onitika

Hoʻohana ʻia ʻo AOI Automatic optical inspection lako no ka ʻike ʻana i ka maikaʻi a me ka pololei o nā pilina uea gula ma nā ʻāpana i hoʻopaʻa ʻia. Hoʻohana ia i nā pahupaʻikiʻi 2D/3D hoʻonā kiʻekiʻe a me nā algorithm hoʻoponopono kiʻi AI no ka ʻike wikiwiki a me ka pololei o ka hoʻopili ʻana i nā pilina uwea gula ma nā ʻāpana ʻōpala. Hiki iā ia ke ʻike i nā ʻāpana e like me ke kūlana welding, kūlana, kiʻekiʻe, offset, a me nā ʻāpana ʻē aʻe o ka uwea gula, a ʻike i nā ʻano anomalies a i ʻole nā ​​hemahema, e like me ka maikaʻi ʻole o ka welding, haki, offset, a me nā pilikia ʻē aʻe. Ma ka ʻike koke ʻana a me ka hoʻoponopono ʻana i nā pilikia me nā pili uea gula, kōkua ia i ka hoʻomaikaʻi ʻana i ka maikaʻi a me ka hilinaʻi o nā ʻōpala i hoʻopaʻa ʻia a hōʻemi i ka helu kīnā o nā chips.

ʻIke 2D AOI

ʻIke 3D AOI

● AOI lako nānā maʻiʻo: hala uea, hewa uea, lele uea, lua uea, ilihune uea arc, gula uea koena, gula uea pōkole kaapuni, solder poepoe detachment, fishtail detachment, solder poepoe XY nui, solder poepoe offset, fishtail XY nui, fishtail offset, uea me ka poepoe ole, capacitor detachment, capacitor offset, Keaukaha capacitor, hoʻoheheʻe ʻia, tombstone IC kaʻa kaʻawale, IC mea hoʻokele haumia, chip kiʻi kiʻi i ʻoki ʻia, chip paʻi kiʻi ʻino, chip kiʻi kiʻi lepo lepo.

ʻO AOI ʻO nā lako nānā ʻike maka ʻokoʻa he loulou kī e hōʻoia i ka hilinaʻi o ke kaʻina hana hoʻopaʻa a hoʻohana nui ʻia i ka hoʻomalu maikaʻi ʻana o ka pahu semiconductor back{0}}end. Inā makemake ʻoe i kahi hopena ʻoi aku ka maikaʻi, e ʻoluʻolu e nīnau iā Huizhou Zhongke Advanced Manufacturing Co., Ltd.

Nā huahana pale: ʻO nā mea hoʻomaʻamaʻa hoʻomaʻamaʻa ʻokoʻa, Kina, nā mea hana, nā mea hoʻolako, nā hale hana

● Hoʻoholo: 0.5μm ~ 5μm (ma muli o ka hoʻonohonoho lens)

● ʻO ka wikiwiki o ka ʻike ʻana: ʻoi aku ka nui o nā kiʻi i kēlā me kēia kekona (e pili ana i ka nui o ke kahua ʻike)

● Pili uea anawaena: 15μm ~ 100μm (gula uea / keleawe uea)

● Hiki hou: ± 1μm3μm